EJOT TSSD®

Specificații

  • Overview

    • Fastening element and process specifically for sandwich elements
    • Broad application range
    • Especially suitable for honeycomb structures
    • High transmittable tensile forces
    • No corrosion
    • Can be used as screw boss or as direct fastening element

Sebastian Schrodt

Head of Sales EJOWELD

The EJOT TSSD® thermal adhesive bonding boss

The EJOT® TSSD (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.

EJOT TSSD® as screw-in boss

If the application involves creating a screw-in option in a component, TSSD® variants without a collar head are used. They are inserted flush into the component during the installation process and then act as a screw-in boss for EVO PT® screws with diameters of 4 or 5 mm.
 

EJOT TSSD® as snap-fit solution

The TSSD® technology can also be used for snap-fit solutions. For this purpose, we offer a variant of the TSSD® with a ball head which -  together with a corresponding counterpart (ball socket) - can be used to create a detachable snap-fit connection. 

Customized TSSD® variants

If the EJOT TSSD® standard solutions do not meet your application-specific requirements, please feel free to talk to us about special solutions. Whether it's a TSSD® for defining a distance to the component, a snap-fit TSSD® for welding onto thin monolithic materials, a TSSD® for the non-detachable joining of e.g. circuit boards or a TSSD® for holding eccentric connectors, as is common in furniture construction. Please contact our experts for further advice.